Verified Company
Wells Electronic Technology Ltd.
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Electronic Circuit factory
Wells Electronic Technology Ltd is a hi-tech company, which specializes in fabricating high precision, high density and high reliability PCB from 1 to 30 layers for over 10 years, our products are used in many industries including, industrial control, power electronics, security electronics, medical electronics,etc
1.Detailed Specification of PCB Manufacturing
1 | Layers | 1 ~ 30 layers |
2 | Material | FR4, High Tg FR4, Halogen Free, Isola, Rogers, Aluminium |
3 | Finished Board Thickness | 0.2mm ~ 7.0mm |
4 | Copper Thickness | 1/3oz ~ 7oz |
5 | Surface Finishing | HASL, Lead Free HAL, Immersion tin, Immersion gold, Gold plating, Immersion silver, OSP, Carbon |
6 | Min. Trace Width/Space | 3mil |
7 | Min. Finish Hole Size | 0.1mm |
8 | Hole tolerance | PTH:±0.076mm, NTPH:±0.05mm |
9 | Soldermask Color | Green, White, Black, Red, Yellow, Blue, |
10 | Silkscreen Color | White, Black, Yellow, Blue |
11 | Impedance Control | +/-10% |
12 | Profiling Punching | Routing, V-CUT, Chamfer |
13 | Special holes | Blind/Buried holes, Countersunk holes |
14 | Reference Standard | IPC-A-600G Class 2, Class 3 |
15 | Certificate | UL, ISO9001, ROHS, SGS |
16 | Package | Vaccum & Carton |
| PCB Assembly Capability: | |
1 | Min. IC Pitch | 0.30mm |
2 | Foot Pin | SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA |
3 | Min. Chip Placement | 01005 |
4 | Max. PCB Size | 410 x 600mm |
5 | Min. PCB Thickness | 0.35mm |
6 | Maximum BGA Size | 74 x 74mm |
7 | BGA Ball Pitch | 1mm ~ 3mm |
8 | BGA Ball Diameter | 0.4mm ~ 1mm |
9 | QFP Lead Pitch | 0.38mm ~ 2.54mm |
10 | Package | Anti-static Bubble Bag & Carton |
2. Product Description
1. Complete products contract PCB assembly and manufacturing services
2. Circuit boards 2 to 30 layers PCB layout, fabrication, PCB assembly and box build
3.Active and passive components source is directly from original manufacturer
4. Enclosure cabinet case plastic injection molding, metal stamping, manufacture and assembly
5. High-precision 0201 size components SMT technology and lead-free
6. IC pre-program
7. High-precision E-Testing include: ICT in circuit, BGA repaire device, etc.
Prototype and Mass Printed Board Assembly (PCBA)
3.PCB & PCBA capability and services:
1.Single-sided, double side & multi-layer PCB with competitive price, good quality and excellent service.
2. Cem-1, fr-4, fr-4 high tg, aluminum base material.
3. Hal, hal lead free, immersion gold/ silver/tin, osp surface treatment.
4.100% e-test.