 Verified Company
 Wells Electronic Technology Ltd.
China
 categorylink |
|
Circuit board assembly, PCB Assembly, PCBA
 Click to enlarge |
| Product： |
| Brand： |
aa |
| Price： |
3.00USD/ |
| MOQ： |
10 |
| Total supply： |
|
| Delivery time： |
From the date of payment from the buyer within days of delivery |
| update time： |
2016-07-25 05:36 Valid to：Long-term effective |
| |
 |
|
| | PCB Capability: | | | 1 | Layers | 2 ~ 30 layers | | 2 | Material | FR4, High Tg FR4, Halogen Free, Isola, Rogers, Aluminium | | 3 | Finished Board Thickness | 0.2mm ~ 7.0mm | | 4 | Copper Thickness | 1/3oz ~ 7oz | | 5 | Surface Finishing | HASL, Lead Free HAL, Immersion tin, Immersion gold, Gold plating, Immersion silver, OSP, Carbon | | 6 | Min. Trace Width/Space | 3mil | | 7 | Min. Finish Hole Size | 0.1mm | | 8 | Hole tolerance | PTH:±0.076mm, NTPH:±0.05mm | | 9 | Soldermask Color | Green, White, Black, Red, Yellow, Blue, | | 10 | Silkscreen Color | White, Black, Yellow, Blue | | 11 | Impedance Control | +/-10% | | 12 | Profiling Punching | Routing, V-CUT, Chamfer | | 13 | Special holes | Blind/Buried holes, Countersunk holes | | 14 | Reference Standard | IPC-A-600G Class 2, Class 3 | | 15 | Certificate | UL, ISO9001, ROHS, SGS | | 16 | Package | Vaccum & Carton | | | PCB Assembly Capability: | | | 1 | Min. IC Pitch | 0.30mm | | 2 | Foot Pin | SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA | | 3 | Min. Chip Placement | 01005 | | 4 | Max. PCB Size | 410 x 600mm | | 5 | Min. PCB Thickness | 0.35mm | | 6 | Maximum BGA Size | 74 x 74mm | | 7 | BGA Ball Pitch | 1mm ~ 3mm | | 8 | BGA Ball Diameter | 0.4mm ~ 1mm | | 9 | QFP Lead Pitch | 0.38mm ~ 2.54mm | | 10 | Package | Anti-static Bubble Bag & Carton |
|
