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Fabrication of microstructures and nanostructures in polymers with high aspect ratios
Applications in MEMS, BIOMEMS and Microfluidics
Mold non-orthgonality compensation
Automatic mold release
Automatic production system (HEX04)
Temperature up to 320 °C (500 °C)
Optoelectronic overlay alignment system for hybrid applications or double-sided embossing
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